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BEAMER

Jul 22 2013
Progress and issues in e-beam and other top down nanolithography
Nezih Unal, Diana Mahlu, Olga Raslin, Daniel Ritter, Christoph Sambale, Ulrich Hofmann
International Conference on Micro and Nono Engineering (MNE) 2009

Nov 21 2011
Modeling and Correction of process effects in (2D / 3D) e-Beam Lithography
U. Hofmann, N. Unal
Beams&More Conference, Stuttgart, 2011

Oct 22 2011
Selective profile transformation of electron-beam exposed multilevel resist structures based on a molecular weight dependent thermal reflow
A. Schleunitz, V.A. Guzenko, A. Schander, M. Vogler and H. Schift
J. Vac. Sci. Technol. B29(6) (2011) 06F302; DOI: 10. 1016/j.mee.2010.12.046 (4pp)

Sep 22 2011
Benchmark of Monte Carlo Simulation for high Resolution Electron Beam Lithography
Karl E. Hoffmann, Marcus Rommel, Thomas Reindl, Jürgen Weis, Nezih Unal, Ulrich Hofmann
International Conference on Micro and Nano Engineering (MNE), Berlin, 2011  

Sep 22 2010
Fabrication of 3-D nanoimprint stamps with continuous reliefs using dose-modulated electron beam lithography and thermal reflow
A. Schleunitz and H. Schift
J. Micromech. Microeng. 20 (2010) 095002; DOI:10. 1088/0960-1317/20/9/095002  

Nov 07 2009
Advanced Modeling & Correction for E-beam Lithography Proximity and Process Effects
Ulrich Hofmann
Beams & More Conference, Stuttgart 2009

Sep 24 2009
Improved CD control and line edge roughness in E-beam lithography through combining proximity effect correction with gray scale techniques
Jens Bolten, Thorsten Wahlbrink, Namil Koo, Heinrich Kurz, Stefan Stammberger, Uli Hofmann, Nezih Ünal
The 35th International Conference on Micro- and Nano-Engineering (MNE) 2009, Gent, Belgium

Sep 22 2009
3rd dimension of PEC
Nezih Unal, Diana Mahlu, Olga Raslin, Daniel Ritter, Christoph Sambale, Ulrich Hofmann
International Conference on Micro and Nono Engineering (MNE) 2009

Sep 21 2009
Easy to adapt electron beam lithography PEC calibration based on visual inspection of a "Best Dose Sensor"
Nezih Unal, Martin D.B. Charlton, Ulrike Waizmann, Thomas Reindl, Ulrich Hofmann
International Conference on Micro and Nano Engineering (MNE) 2009